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Electrical

Elementary

  • Electrons
  • Voltage, Current
  • Transformers, Power Factor
  • Logic Gates, Operational Amplifiers
  • Direct Current, Alternating Current
  • Resistance, Capacitance, Inductance, Impedance
  • Transistors, Integrated Circuits

Circuit

  • Open Circuit, Closed Circuit
  • Open Loop Control, Closed Loop Control

Signal

  • Digital, Analog
  • Serial, Parallel
  • Full-Duplex, Half-Duplex
  • Superposition, Constructive/Destructive Interference
  • Diffraction

Printed Circuit Board (PCB)

Stack:

  • Silkscreen
  • Conductive Surface Finish
  • Soldermask
  • Conductive Layer
  • Prepreg (Stick)
  • Core (Rigid)

Specifications:

  • Material
  • Conductive Layers (Internal, External, Thickness)
  • Vias, Holes, Slots
  • Castellations

Protection:

  • Enclosure
  • Encapsulation
  • Conformal Coating

Integrated Circuit (IC)

Connectors

  • Housing (M/F), Contact, Receptable (F), Plug (M)
  • Pin, Blade
  • Rectangular, Circular
  • Terminal Position Assurance (TPA)
  • Flame Resistance (UL 94)
  • Glow Wire Compliance
  • Row Count
  • Contact Points
  • Vibration Resistance
  • Locking Detent

Mounting

Parts:

  • Through Hole
  • Surface Mount
  • Chassis Mount
  • Panel Mount
  • Inline

Connectors:

  • Wire-to-Board
  • Wire-to-Wire
  • Board-to-Board
  • Backplane

Circuit Protection

  • Signaling, Clamping, Impeding
  • Overvoltage Protection (OVP)
  • Overcurrent Protection (OCP)
  • Reverse Polarity Protection
  • Thermal Protection

Safety

  • RoHS Compliant
  • Halogen Free
  • Safety Extra Low Voltage (SELV)
  • Ground Fault Circuit Interrupt (GFCI)
  • Emergency Stop
  • Anti-Arcing
  • Circuit Breaker

Reliability

  • Wide Operating Temperature
  • AEC-Q200

PART FUNCTIONS

  • Resistors, Capacitors, Inductors
  • Current Sense Resistor
  • Current Sense IC

Overvoltage Protection

  • TVS Diodes
  • Metal Oxide Varistors

Discrete Element Uses

  • Pull Up Resistor
  • Pull Down Resistor
  • Decoupling Capacitor (Power)
  • Bypass Capacitor (Signal)

Embedded

  • Cores, Caches
  • Address Bus, Data Bus
  • Architecture, Bit Count, RISC vs CISC
  • MCU vs MPU

Ground

  • Signal Ground, Chassis Ground, Earth Ground
  • Ground Loop

SENSORS

  • Hall Effect
  • Magnetoresistive Effect (GMR)

Standards

  • HDD Physical/Logical Sector Size (4k, 512e, 512n) *

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